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International Conference On Biomedical Engineering And Applications
INVITATIONIt is our great pleasure to invite you to participate in the International Conference On Biomedical Engineering And Applications – ICBEA, to be held in Funchal, Madeira Island, July 9th to 12th, 2018, organised by the Institute of Knowledge and Development, the University of Madeira and the Madeira Interactive Technologies Institute jointly. Contributions are welcome in both theoretical developments and practical implementations in all areas involving Biomedical Engineering. Between all contributions presented, two will be selected to receive a best paper award. More information in the call for papers. ICBEA will provide an excellent opportunity for presenting new results and to discuss the latest research and developments in the field. Participation of young scientists is strongly encouraged. A reduced registration fee will be available for students. The conference is intended as an international forum where an effective exchange of knowledge and experience amongst researchers active in various theoretical and applied areas can take place.Participation of scientists from academia and industry is particularly welcome. The program will include also considerable space for promoting new technical applications and developments, real-world challenges and success stories. |
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Paper Submission Guidelines
All papers must be submitted electronically and in PDF format, through easychair. The material presented should be original and not published or under submission elsewhere. Each paper is limited to 6 pages (or 10 pages with the over length charge), following strictly the IEEE conference proceedings format (A4, Two-Column) that can be found here. Figures and references must be included in the 10 pages. Oversized papers will be automatically rejected by the PC chairs. At least one of the authors of each accepted paper must register early to attend the conference, in order for the paper to appear in the conference proceedings.
2018 Proceedings will be submitted for inclusion in IEEE Xplore/Digital Library.
